The IEC is in the process of endorsing IPC-A as the globally preferred international acceptance standard for electronics assembly. AE training for through hole and surface mount solder joint acceptance standards inspection from IPC, a trade association for the electronics industry. IPC-AG is the latest revision of the most widely used electronics assembly standard in the world. IPC AG is now available from.

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Chinese – Download – Single-User License: There are new sections on depanelization, board in board, package on package, and flex attachment, which Jack Crawford, IPC director of certification, calls “high ipd topics. In addition, the standard has been revamped for ease of use and clarity.

The document synchronizes to the requirements expressed in other industry consensus documents and is used with iipc material and process standard IPC J-STD Please allow 2 business days for us to review and process your order. Translations of the revised standard in multiple languages will be released in the coming months.

IPC-A-610E: Acceptability of Electronic Assemblies

Sections have been reorganized so data and images are easier to find and to make it easier to use. Acceptability of Electronic Assemblies.


IPC-A is invaluable for all inspectors, operators and trainers. We will continue to accept orders via e-mail and web during our office closure.

IPC-A-610E IPC Certification

This revision has been critically reviewed for clarity and accuracy. See More See Less. Training Media Permissible Uses. Designers and manufacturers will appreciate criteria for package-on-package technologies, often used to boost solid-state memory capacity, and for board-in-board connections, where daughter boards can be mounted perpendicular to the assembly using a through-the-board method.

IPC-AE Released: Industry Requirements for Acceptability of Electronic Assemblies Updated | IPC

IPC maintains additional offices in Taos, N. Zenaida Valianu, training and development specialist at Celestica agrees, “The document is more intuitive and manageable than before, allowing users to navigate more easily and locate information promptly. The photos and drawings that show good and bad connections, considered one of the most important features of IPC-A, have also been upgraded.

IPC-A is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-AE illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. IPC’s most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.


IPC-AE IPC Certification

The E revision contains new or updated illustrations, bringing the total to more than To view this site, you must enable JavaScript or upgrade to a JavaScript-capable browser. IPC J-STDE provides material and process requirements for producing soldered electrical and electronic assemblies, aiding those who set up manufacturing processes. ipf

For more information on IPCE, visit www. Revision E has photos and illustrations of acceptability criteria of them new or updated.

The many changes that have occurred in array packaging since the standard’s last revision are 60e addressed in the E revision, as are changes to hot tear and fillet lifting. Javascript is disabled on your browser. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT new termination styles and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.